200mm

The SPTS MVD100E is a Molecular Vapor Deposition system designated for R&D or pilot manufacturing.

The Tegal 4200 SE is an advanced cluster platform for 3D IC and MEMS applications.

The Disco DFL7340 is a stealth dicing system used for silicon wafer dicing.

The Filmetrics R50 – 200 – 4PP is a metrology tool configured by default for metallic layers and sample thicknesses of 525 µm ± 25 µm.

Zeiss 200 mm Scanning Electron Microscope.

The ASML PAS 5500/275D is a high-throughput i-line stepper with 5X reduction, 365 nm exposure, and automated wafer handling for substrates up to 200 mm diameter.

Veeco Dektak 150 is a stylus-based surface profiler used for measuring surface topography and thin film step heights.

The AJA BSG-200 Series Substrate Holder is a backside-gas-cooled rotating substrate holder for wafers or similar planar substrates up to 200 mm in diameter.

The SCREEN / DNS SS W 80 A-AR is a scrubber with 8 inch wafer size support.

SPTS lists the c2L as a 200mm tool in its Equipment Training course offerings.

The Tegal 3200 SE is an advanced cluster platform for 3D IC and MEMS applications that can be configured with up to 3 process modules.

The ASM E 2000 is a radiantly heated, single-wafer epitaxial reactor for chemical vapor deposition of doped or undoped silicon layers on wafers up to 200 mm (8 inches).

The Plasma Therm 720/740 is a dual-chamber RIE loadlocked system with chlorine- and fluorine-based chemistry.

Nikon NSR 2205 i 14 E 2 is an i-line stepper.

The KLA Tencor P-2 is a profilometer with a 200 mm sample table with vacuum and a 3D scan option.

The Memsstar Orbis Alpha Oxide Etch System is a small-footprint, self-contained oxide etch system that uses hydrogen fluoride etchants.

The KLA Archer 10 XT Overlay System is a 200mm overlay metrology system with refurbishment-upgraded components and software version 5.6.

The J.A. Woollam RC2 is a spectroscopic ellipsometer used to measure thin-film thickness and refractive indices.

The CEE 200CBX is a precision coat-bake system described as a track-quality spin coater with a high-uniformity bake plate.

The Semitool 4300 S SRD is a spin rinse dryer with a single-stack configuration and 200mm wafer particle specification.

The AJA BSG-200 Series is a substrate holder for wafers or similar planar substrates up to 200 mm in diameter with direct backside gas cooling while rotating.

The Laurell EDC-650-8 is a station-mounted spin processor that accommodates up to 200 mm wafers and 7 in x 7 in substrates.

The CEE 200 Bake Plate is a bake plate for up to 200mm wafers with Internal OS software and 208V power.

Mattson 8800 is a third-generation RTP tool developed for 0.25-micron process requirements and described as a 200 mm single-wafer RTP tool.

The Despatch AST-3100 is an automated polyimide curing tool designed for 200mm and 300mm wafers.

Tegal 980 ACS is a plasma etch system series described as serving the 200mm fab line.

The Thermo Fisher Scientific / FEI NanoLab 1200 AT FIB is a focused ion beam system with an integrated Electron column and supporting inspection, wafer handling, and gas delivery components.

The EVG Gemini Automated Production Wafer Bonder is a wafer bonder with face-to-face alignment and automation features, supporting wafers up to 8"/200mm.

Oxford Instruments PlasmaPro80 is an RIE dry etcher used for hBN, SiGe, graphite, and graphene etching.

The ZYGO Z3D-7000 is a non-contact, optical metrology system for semiconductor wafers that accommodates 200 mm and 300 mm wafer sizes.

EVG40 is an EV Group top-to-bottom side alignment accuracy measurement inspection system for non-destructive measurement of repeatable alignment accuracy.

The Disco DFL7340 stealth dicing system is used for dicing silicon wafers and is dedicated to Si wafers only.

The EV Group 850 LT SOI Fusion Wafer Bonder is a fully automatic wafer bonder configured for 8-inch/200mm wafers.

The Laurell WS-650-8B is a compact 650-series spin coater with a maximum rotational speed of 12,000 RPM and support for wafers up to 200 mm.

The YES 8-2P-CP is a manual-load high-temperature cure oven in the PB Series, specified for 200 mm wafers.

The KLA Tencor P-15 is a profilometer with a 200 mm sample table with vacuum.

The SPTS MVD300 is a Molecular Vapor Deposition system designed for high-performance, flexible, reliable high-volume manufacturing applications.

Oxford Instruments Plasmalab 80+ is a compact open-loading reactive ion etch system for R&D or small-scale production.

The MPI TS2000-IFE is a 200-mm automated probe station with micron precision used in a terahertz small-signal probe station configuration.

The Filmetrics RS50 is a 4-point probe mapping system for sheet resistance measurement.

The Disco DFL7340 stealth dicing system is used for dicing silicon wafers and is dedicated to Si wafers only.

Electroglas EG4|200 is a wafer prober for 200mm wafer applications, and the EG4|200e is a related variant described for ultra-low-noise probing.

The Laurell EDC-HL-8 B is a compact EDC spin processor that accommodates up to 200 mm wafers and 7 in × 7 in substrates.

The Laurell H6-8 is a 650-series HL spin coater that accommodates up to 200mm wafers and 7" × 7" substrates and has a maximum rotational speed of 12,000 RPM.

The YES CV108 is a single-wafer downstream plasma stripper/descummer for removing photoresist, polyimide, and B.C.B. coatings.

The YES 450PB is a high-temperature vacuum cure oven series for MEMS and semiconductor process applications, with related stainless-steel cassette accessories designed for the series.

The Accretech / TSK UF 200 S is a prober for 8-inch wafers, with sources also stating it was configured for 8-inch (200mm) operation.