AJA
BSG-200Series
The AJA BSG-200Series is a substrate holder designed to handle wafers or similar planar substrates up to 200 mm in diameter. The AJA BSG-200Series features direct backside He, Ar or N2 gas cooling while rotating. The AJA BSG-200Series is load-lock compatible.[1][2]
Wafer size
200mm
Gas delivery
He, Ar or N2 gas cooling[1]
What it is
General reference — not yet source-verifiedA substrate holder in an ion milling tool supports the wafer or sample during physical etching. A substrate holder in this equipment class commonly provides thermal control and motion so the exposed surface can be presented to the ion beam under controlled conditions.
How it works
The BSG200 operates as a rotating wafer table in ion milling service. The BSG200 is equipped with helium gas backside cooling and programmable working distance adjustment. The ATC 1800-IM configuration that uses the BSG200 pairs the holder with a gridded ion source positioned for uniform milling of a 200mm substrate.[1][2]
Where it fits in the process flow
General reference — not yet source-verifiedIon milling equipment is used during pattern transfer, surface cleaning, thinning, and related physical etch steps in research and production process flows. A substrate holder of this class sits inside the process chamber and functions during the etch step between sample loading and subsequent inspection, deposition, or further patterning operations.
Applications
What do the numbers mean?
Vacuum & pumping1
- Backside gas pressure feature
- Peripheral weight ring around the outer edge of the substrates helps maintain a 2 orders of magnitude higher backside gas pressure[1]
Wafer handling4
Gas & chemistry3
Configuration & options4
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Backside cooling gasesHe, Ar or N2 gas cooling[1]
- Backside gas pressure featurePeripheral weight ring around the outer edge of the substrates helps maintain a 2 orders of magnitude higher backside gas pressure[1]
- Backside cooling gasHe, Ar or N2[1]
- Backside gas coolingDirect backside He, Ar or N2 gas cooling while rotating[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Why is the holder important for process consistency?General reference — not yet source-verified
Because the holder sets the geometry between the substrate and the active process region, it influences uniform exposure, repeatable alignment, and stable handling conditions from run to run.
Can a substrate holder affect temperature control?General reference — not yet source-verified
Yes. Machines of this class often play a direct role in heating or cooling the substrate through conduction, reduced thermal contact, or integration with temperature-control features in the host tool.
Can the holder influence electrical conditions at the substrate?General reference — not yet source-verified
Yes. Depending on the application, such systems may provide grounding, electrical isolation, or a path for applied bias, all of which can matter in plasma and thin-film processes.
Not publicly documented
The following facts about the BSG-200Series are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the BSG-200Series are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the BSG-200Series are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the BSG-200Series are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the BSG-200Series are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the BSG-200Series is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]web.archive.org — web.archive.orgweb.archive.org
Last updated Oct 20, 2026.
