Applied Materials

9500 XR 200 S

Research Quality: 40% complete

The Applied Materials 9500 XR 200 S System is a semiconductor processing system configured for 6‑inch wafers. The system includes a CT‑10 Cryos chamber, an IHC source, dual bellows extraction at 60 kV, and post‑acceleration up to 160 kV for a total energy of 200 kV.^[1]

9500 XR 200 S — Inventory photo — Fig. 019500 XR 200 SInventory photo^[1]

Power

3 Phase + Neutral^[1]

Vacuum

Pump Config:^[1]

Gas delivery

Gas Box:^[1]

What it is

The Applied Materials 9500 XR 200 S is a semiconductor processing system configured for 6-inch wafers. The Applied Materials 9500 XR 200 S includes a CT-10 Cryos chamber, an IHC source, dual bellows extraction at 60 kV, and post-acceleration up to 160 kV for a maximum total energy of 200 kV.^[2]^[1]

What do the numbers mean?

Power & electrical4

Phase: 3 Phase + Neutral^[1]; 50/60 Hz^[1]
Voltage: 208 V^[1]
Power: 3 Phase + Neutral - 50/60 Hz - 208 V^[1]

Vacuum & pumping4

Pump Config:^[1]
Chamber: CT-10 Cryos^[1]
Source Turbo: STP-1000C^[1]
Mrs Turbo: STP-361C^[1]

Wafer handling4

Wafer Loader: QDP80 w/ EH500 Blower^[1]
Wafer Sizes: 6 inch^[1]
Wafer on Gripper Sensor: 2000 Vintage^[1]
Wafer size: 6 inch^[1]

Gas & chemistry2

Gas Box:^[1]
Gas Box Gases: BF3: SDS, PH3: SDS, AsH3: SDS, SiF4: SDS, Argon: External Feed^[1]

Control & software1

Software: 4.06^[1]

Configuration & options23

CPU: MVME162-P244LSE^[1]
BF3: SDS^[1]
PH3: SDS^[1]
AsH3: SDS^[1]
SiF4: SDS^[1]
Argon: External Feed^[1]
Source Backing: QDP40^[1]
Source Type: IHC^[1]; Enlarged Chamber^[1]
Oven Capabilities: Oven fitted to source^[1]
Enlarged Chamber: Yes^[1]
Source Magnet: 40A^[1]
Extraction: Dual Bellows 60kV^[1]
Post Acell: 160kV max^[1]
Total Energy: 200kV max^[1]
Plasma Flood Gun: HDPFS^[1]
Wheel: Direct Drive^[1]
Tilt: 0 to 7^[1]
Orient: fitted, not in use^[1]
Flat Not Found Sensor: fitted, not in use^[1]
Gripper: Hollow^[1]
Post Acell: 160kV max, total energy 200kV max^[1]
Post acceleration: 160kV max^[1]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Phase3 Phase + Neutral^[1]
Configuration50/60 Hz^[1]
Voltage208 V^[1]
ConfigurationGas Box:^[1]
ConfigurationPump Config:^[1]
ChamberCT-10 Cryos^[1]
Source TurboSTP-1000C^[1]
Mrs TurboSTP-361C^[1]
Power3 Phase + Neutral - 50/60 Hz - 208 V^[1]
Gas Box GasesBF3: SDS, PH3: SDS, AsH3: SDS, SiF4: SDS, Argon: External Feed^[1]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What wafer size does the Applied Materials 9500 XR 200 S support?

The Applied Materials 9500 XR 200 S supports 6-inch wafers.^[2]^[1]

What is the maximum total energy of the Applied Materials 9500 XR 200 S?

The Applied Materials 9500 XR 200 S has post-acceleration up to 160 kV and a maximum total energy of 200 kV.^[2]^[1]

What gas sources are configured on the Applied Materials 9500 XR 200 S?

The Applied Materials 9500 XR 200 S is configured with BF3, PH3, AsH3, and SiF4 in the gas box with SDS, plus an external argon feed.^[2]^[1]

Does the Applied Materials 9500 XR 200 S include a plasma flood gun?

The Applied Materials 9500 XR 200 S includes an HDPFS plasma flood gun.^[2]^[1]

Not publicly documented

The following facts about the 9500 XR 200 S are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 9500 XR 200 S are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 9500 XR 200 S are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 9500 XR 200 S are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 9500 XR 200 S are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 9500 XR 200 S is not on record.
Answerable by: an OEM datasheet or a fab qualification report