Applied Materials
Endura CL
What it is
General reference — not yet source-verifiedThe Endura CL is a chamber module designed for use within the Applied Materials Endura platform, a cluster tool architecture employed in semiconductor fabrication. The module is used for thin film deposition processes in a vacuum environment.
How it works
General reference — not yet source-verifiedAs part of the Endura cluster tool, the Endura CL chamber typically operates under high vacuum to enable controlled deposition of thin films. The chamber supports physical vapor deposition (PVD), also known as sputtering, where a target material is bombarded with ions to eject atoms that then deposit onto a substrate.
Where it fits in the process flow
General reference — not yet source-verifiedIn a semiconductor manufacturing workflow, the Endura CL chamber is used in the deposition stage, typically after pre-clean and degas steps, and before photolithography and etching. The chamber is often part of a larger process sequence for forming metal layers, barrier films, or contact layers.
Upstream processes include wafer cleaning and surface preparation, while downstream steps may involve annealing, chemical mechanical planarization (CMP), or further deposition. The cluster tool architecture enables these steps to be performed in a controlled vacuum environment, minimizing contamination.
What do the numbers mean?
Power & electrical6
Control & software1
Configuration & options29
- Preclean[3]
- ESIP TAN (No Target)[4]
- Degas STD[5]
- 4 wires[1]
- Chamber 1:[1]
- SIP-TA(N)[1]
- Chamber 2:[1]
- SIP-CU[1]
- Chamber 3:[1]
- Chamber 4:[1]
- process type None[1]
- Chamber C:[1]
- PCXT[1]
- Chamber D:[1]
- Ti[6]
Vintage & configurations
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the Endura CL are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Endura CL are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Endura CL are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Endura CL are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Endura CL is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Endura CL are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (9)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]inventory listing
- [4]inventory listing
- [5]inventory listing
- [6]inventory listing
- [7]Equipment inventory listing
- [8]Equipment inventory listing
- [9]Equipment inventory listing
Last updated Oct 11, 2026.
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