Tool family
Applied Materials Endura is a deposition system used in semiconductor manufacturing. It belongs to the class of tools that form thin films on substrates for later patterning and integration into device structures.
The Applied Materials Endura 1 is a 12-inch wafer metal processing tool.
Applied Materials Endura 2 is a 12-inch PVD (physical vapor deposition) system used for liner/barrier and front-end metallization applications.
Applied Materials Endura 2 Chambers is a semiconductor equipment item with Chamber A without heater, Chamber B with heater, and Chamber C without heater.
Applied Materials Endura 4.0 is a PVD (Physical Vapor Deposition) system with 25-wafer FOUP loadports.
Applied Materials Endura HP is a PVD sputter physical vapor deposition system.
General referenceApplied Materials Endura is a deposition system used in semiconductor manufacturing. It belongs to the class of tools that form thin films on substrates for later patterning and integration into device structures.
The Applied Materials Endura 1 is a 12-inch wafer metal processing tool.
Applied Materials Endura 2 is a 12-inch PVD (physical vapor deposition) system used for liner/barrier and front-end metallization applications.
Applied Materials Endura 2 Chambers is a semiconductor equipment item with Chamber A without heater, Chamber B with heater, and Chamber C without heater.
Applied Materials Endura 4.0 is a PVD (Physical Vapor Deposition) system with 25-wafer FOUP loadports.
Applied Materials Endura HP is a PVD sputter physical vapor deposition system.