ASM
AD 838 L G 2
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
General reference — not yet source-verifiedA die bonder is packaging and bonding equipment that places singulated semiconductor die onto a package, substrate, leadframe, or other target carrier. Die bonders are used after wafer fabrication and dicing to create an assembled device that can proceed to later packaging steps.
Where it fits in the process flow
General reference — not yet source-verifiedDie bonding sits in semiconductor assembly after wafer processing and die separation. Die bonding commonly precedes interconnect formation, encapsulation, and final package completion.
Applications
General reference — not yet source-verifiedDie bonders are used wherever bare semiconductor die must be attached accurately to a destination part for later electrical and mechanical completion. Die bonders are used in integrated circuit packaging, optoelectronic assembly, sensor packaging, and similar microelectronic assembly flows.
Why won't it start?
Documented failure modes, common issues, and field considerations.
- One of the two archerfish dispensing modules does not work.
- The gripper needs to be leveled.
What do the numbers mean?
Wafer handling1
Configuration & options6
- One of the two archerfish dispensing modules does not work[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the AD 838 L G 2 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the AD 838 L G 2 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the AD 838 L G 2 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the AD 838 L G 2 are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the AD 838 L G 2 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the AD 838 L G 2 are on record.
Answerable by: an OEM parts catalog or a service engineer
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]semi-sps.com — semi-sps.comsemi-sps.com
Last updated Oct 15, 2026.
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