Waferpedia

Tool family

ASM AD 838

Models in this family

  1. The ASM AD 838 is an 8-inch-wafer die bonder with epoxy dispensing and no stack input, operating on single-phase 220 Vac at 50/60 Hz.

  2. Cited variants

    DesignationGenerationVintageChangesSource
    AD 838 L G 22020Listed as a die bonder for 6-inch and 8-inch wafers; one of the two archerfish dispensing modules does not work; gripper needs to be leveled.Equipment inventory listing[1]
  3. ASM AD 838 L Dual Epoxy System is a wafer-table epoxy system for 8-inch wafers with an automatic wafer loader, needle ejector, and input/output magazine handlers.

  4. The ASM AD 838 L Epoxy is a die bonder with an epoxy dispenser.

  5. ASM AD 838 L G 2 is a die bonder with support for 6-inch and 8-inch wafer sizes.

All entries

  1. AD 838ASM

    The ASM AD 838 is an 8-inch-wafer die bonder with epoxy dispensing and no stack input, operating on single-phase 220 Vac at 50/60 Hz.

    CategoryPackaging & BondingWafer8"
    13 specs
  2. AD 838 LASM
    CategoryPackaging & Bonding
    3 specs
  3. AD 838 L Dual EpoxyASM

    ASM AD 838 L Dual Epoxy System is a wafer-table epoxy system for 8-inch wafers with an automatic wafer loader, needle ejector, and input/output magazine handlers.

    WaferWafer table with wafer expander for 8”
    4 specs
  4. AD 838 L EpoxyASM

    The ASM AD 838 L Epoxy is a die bonder with an epoxy dispenser.

    CategoryPackaging & Bonding
    1 spec
  5. AD 838 L G 2ASM

    ASM AD 838 L G 2 is a die bonder with support for 6-inch and 8-inch wafer sizes.

    CategoryPackaging & Bonding
    1 spec

Sources

Sources (1)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing