AD 898 Automatic

The ASM AD 898 is an automatic die bonder. The ASM AD 898 is manufactured by ASM. The ASM AD 898 is used for semiconductor packaging. The ASM AD 898 belongs to the Packaging & Bonding equipment category.^[1][2][3]

A die bonder is an assembly machine that picks a singulated semiconductor die, places the die onto a package or substrate, and forms the placement needed for later interconnection and encapsulation. Automatic die bonders use coordinated handling, placement, and process control to repeat that sequence across production lots. Die bonders generally depend on alignment between the die and the target site so that placement occurs in the intended position and orientation.

Die bonding sits in semiconductor assembly after wafer-level fabrication and after the die has been separated from the wafer. Die bonding comes before later package-assembly steps such as electrical interconnection and final enclosure of the device. In an assembly flow, a die bonder connects front-end semiconductor output to downstream package construction.

Automatic die bonders are used where semiconductor die must be attached to package elements or other mounting surfaces during assembly. Such equipment is applied in packaging flows that require repeatable die placement before wire interconnection or related bonding operations. Die bonders can support assembly work across integrated-device and similar microelectronic packaging contexts.