ADL 838 LG 2

The ASM ADL 838 LG 2 is a die bonder in the packaging and bonding equipment class. The ASM ADL 838 LG 2 uses clamp ring or wafer expander input. The ASM ADL 838 LG 2 supports 6-inch wafers on clamp ring and 8-inch wafers on expander.^[1][2]

Die bonders pick singulated or partially prepared die from wafer presentation hardware and place them onto substrates or packages with controlled alignment and bonding force. Die bonders commonly combine wafer handling, vision-based alignment, bond-head motion, and substrate handling in one platform. Die bonders are used after wafer fabrication to create packaged or assembled semiconductor devices.

Die bonding sits in semiconductor assembly flow after wafer fabrication and dicing-related preparation, when individual die must be attached to a substrate, leadframe, carrier, or package element. Die bonding precedes later package interconnection and enclosure steps such as wire bonding, underfill, encapsulation, lid attach, or final singulation, depending on the package design.

The ASM ADL 838 LG 2 handles die sizes from 6 x 6 mil to 80 x 80 mil, corresponding to 0.15 x 0.15 mm to 2.03 x 2.03 mm. The ASM ADL 838 LG 2 handles die sizes from 6 x 6 mil to 400 x 400 mil, corresponding to 0.15 x 0.15 mm to 10.16 x 10.16 mm, without up-look inspection. The ASM ADL 838 LG 2 includes standard flip chip handling.^[1][2]