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Wire bonders are semiconductor packaging tools that create electrical interconnects between a device and its package or substrate using fine wire. Wire bonders are used after die attach and before final encapsulation or lid attach. Wire bonding is a standard back end assembly step for many integrated circuits and discrete devices.

Wire bonders generally place a semiconductor device or package under a bonding head, form a bond at one connection point, loop the wire to a second connection point, and then terminate the wire. Wire bonders rely on precise control of position, bond force, time, and energy to produce repeatable interconnects. Wire bonders commonly use vision alignment and programmed bond paths to connect die pads to package leads or substrate features.

Wire bonding sits in semiconductor assembly after the die has been attached to a leadframe, package, or substrate. Wire bonding creates the electrical path from the die to the external package interconnect structure. Packaging flow after wire bonding commonly proceeds to molding, encapsulation, lid sealing, marking, singulation, and final test, depending on the package design.

Wire bonders are used for packaged semiconductor devices that need electrical connection from bond pads on the die to leads or substrate metallization. Wire bonding is applied in assembly flows for integrated circuits, power devices, sensors, optoelectronic devices, and other microelectronic components. Wire bonding is also used in package styles where direct wire interconnection remains compatible with the electrical, thermal, and mechanical requirements of the device.