Waferpedia

Tool family

ASM iHawk

ASMPackaging & Bonding2 entries
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Models in this family

  1. iHawk Aeropanel

    ASM iHawk Aeropanel is a wire bonder described with 220 V, 50/60 Hz, and 1.5 KVA power specifications.

  2. iHawk Xtreme

    The ASM iHawk Xtreme is an automatic wire bonder used in semiconductor packaging, supporting gold, copper, and alloy wires with capabilities including ultra-low loop control and automatic wire rethreading.

All entries

  1. iHawk AeropanelASM

    ASM iHawk Aeropanel is a wire bonder described with 220 V, 50/60 Hz, and 1.5 KVA power specifications.

    CategoryPackaging & Bonding
    3 specs
  2. iHawk XtremeASM

    The ASM iHawk Xtreme is an automatic wire bonder used in semiconductor packaging, supporting gold, copper, and alloy wires with capabilities including ultra-low loop control and automatic wire rethreading.

    CategoryPackaging & Bonding
    17 specs