ASM
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
Power
200 VAC 1 Phase 2 Wires + GND 50/60 Hz[4]
Performance
±1µm[2]
Optics
Programmable optics UGK kit[1]
Wire bonders connect the integrated circuit die to the lead frame or substrate using fine wire.
The ASM iHawk Xtreme is used after die bonding and before encapsulation in the semiconductor packaging process.
The ASM iHawk Xtreme is applied in semiconductor packaging for wire bonding of integrated circuits and other devices.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
No research found yet — worked with this tool? Share what you know.
The following facts about the iHawk Xtreme are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the iHawk Xtreme are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the iHawk Xtreme are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the iHawk Xtreme are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the iHawk Xtreme are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the iHawk Xtreme is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Last updated Sep 2, 2026.
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
The Logitech 1 WBS 1 is a wafer substrate bonder for 6-inch wafers.