ASM
Peva 900 E
The ASM Peva 900 E is a deposition planetary wafer system. The ASM Peva 900 E uses a 4-crucible turret. The ASM Peva 900 E supports gas delivery of Ti, Ni, and Ag.[1][2]
Wafer size
planetary wafer system
Gas delivery
Ti, Ni, Ag[1]
What it is
How it works
The ASM Peva 900 E has a 4 crucible turret and a planetary wafer system. The ASM Peva 900 E is configured for Ti, Ni, and Ag gas capability.[1]
Where it fits in the process flow
General reference — not yet source-verifiedDeposition equipment is used after substrate preparation and before later patterning, etch, lift off, anneal, or integration steps, depending on the device flow. Thin film deposition sits at points in the process where a wafer needs a new functional surface layer for conduction, adhesion, reflection, diffusion control, or device formation. The output of deposition is typically inspected and then passed to subsequent module steps that define or modify the deposited film.
Applications
General reference — not yet source-verifiedDeposition systems are used to create thin metal and functional films for microelectronic, sensor, and related wafer level structures. Such tools support processes where a wafer needs a deposited layer that can later serve as an electrical path, contact surface, seed layer, adhesion layer, reflective surface, or part of a stacked film system.
What do the numbers mean?
Wafer handling2
Gas & chemistry1
Control & software1
Configuration & options9
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- GasTi, Ni, Ag[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the Peva 900 E are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Peva 900 E are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Peva 900 E are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Peva 900 E are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Peva 900 E are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Peva 900 E is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 18, 2026.
Compare with similar tools
View all →
The Applied Materials 0010-13622 is an RF match unit intended for PVD (Physical Vapor Deposition) described as a High Efficiency HE RF Match-Bias.
The Applied Materials 0020 12458 Part is an insulator, side match component for the Hdp-Cvd Ultima Plus system.