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The Twinscan NXT:2050i is a deep ultraviolet immersion scanner for high-volume manufacturing at advanced logic and memory nodes. The Twinscan NXT:2050i uses 193 nm ArF immersion optics and an advanced wafer stage design to drive thousands of wafers per day through critical patterning steps.[1]
The Twinscan NXT 2050 i uses 193 nm argon-fluoride (ArF) immersion optics. A thin layer of water is introduced between the final lens and the wafer to increase the numerical aperture, enabling finer resolution than dry DUV systems. The system employs a dual-stage wafer stage that allows one wafer to be aligned while another is being exposed, reducing idle time. The NXT:2050i is positioned for throughput ranges similar to typical DUV immersion systems, which can exceed 250 wafers per hour under volume conditions.[1][3]
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The Twinscan NXT 2050 i processes 300 mm (12 inch) wafers.[2][3]
Yes, the Twinscan NXT 2050 i is an immersion lithography system that uses a thin water layer between the lens and wafer to increase numerical aperture.[1]
The Twinscan NXT 2050 i uses a dual-stage wafer stage where one wafer is aligned while another is exposed.[1]
The Twinscan NXT 2050 i targets critical and non-critical layers in nodes around and below the 10 nm class.[1]
The following facts about the Twinscan NXT 2050 i Immersion are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Twinscan NXT 2050 i Immersion are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Twinscan NXT 2050 i Immersion are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Twinscan NXT 2050 i Immersion are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Twinscan NXT 2050 i Immersion are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Twinscan NXT 2050 i Immersion is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Aug 20, 2026.
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.