Brooks
PRE 200 200 B 201 201 B Wafer Pre-Aligner
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Brooks / PRI PRE 200 / 200 B / 201 / 201 B is a wafer pre-aligner used in semiconductor manufacturing. The Brooks / PRI PRE 200 / 200 B / 201 / 201 B handles 6-inch wafers.[1][2]
What it is
How it works
General reference — not yet source-verifiedA wafer pre-aligner is used to orient a wafer before later lithography handling steps. The machine class typically centers and rotationally references the wafer so downstream tools can receive a consistent wafer position.
A pre-aligner is placed in the wafer-handling path rather than in the exposure step itself. The machine class supports repeatable wafer presentation for subsequent processing.
Where it fits in the process flow
General reference — not yet source-verifiedA wafer pre-aligner generally serves upstream of mask alignment or other lithography handling equipment. The machine class helps establish wafer orientation before the next process stage.
Applications
General reference — not yet source-verifiedThe machine class is relevant in production flows that require controlled wafer orientation before lithographic processing. The class is used with wafers rather than with finished devices.
What do the numbers mean?
Wafer handling1
Vintage & configurations
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the PRE 200 200 B 201 201 B Wafer Pre-Aligner are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the PRE 200 200 B 201 201 B Wafer Pre-Aligner are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the PRE 200 200 B 201 201 B Wafer Pre-Aligner are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the PRE 200 200 B 201 201 B Wafer Pre-Aligner are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the PRE 200 200 B 201 201 B Wafer Pre-Aligner are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the PRE 200 200 B 201 201 B Wafer Pre-Aligner is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]waferpedia.com — waferpedia.comwaferpedia.com
- [2]Equipment inventory listing
Last updated Oct 11, 2026.
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