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MPS 4-20 C Vacuum

DepositionCHA MPS 4-20 C Vacuum family
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Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

MPS 4-20 C Vacuum — Inventory photo
Fig. 01MPS 4-20 C VacuumInventory photo[1]

What it is

The CHA MPS 4-20 C Vacuum is a vacuum evaporator. The CHA MPS 4-20 C Vacuum is categorized as deposition equipment. The CHA MPS 4-20 C Vacuum family includes the MPS 4-20 C Vacuum model.[2][3]

How it works

The CHA MPS 4-20 C Vacuum requires air at 90-100 PSI. The CHA MPS 4-20 C Vacuum requires water at 8.25 GPM.[1][2]

Where it fits in the process flow

General reference — not yet source-verified

Vacuum evaporators are used in thin film sequence steps where a substrate needs a deposited layer before later patterning, lift off, etch, bonding, or assembly operations. Vacuum evaporation commonly appears after substrate preparation and before inspection or subsequent integration steps.

Applications

General reference — not yet source-verified

Vacuum evaporators are used for thin film formation in microfabrication, device development, and related coating work where directional deposition is useful. Such tools are commonly applied to conductive, adhesion, and optical coating tasks, especially when patterned deposition by shadow masking or lift off is part of the process scheme.

What do the numbers mean?

Vacuum & pumping2

Air
90-100 PSI[1]
Accurate?
Type
vacuum evaporator[2]
Accurate?

Configuration & options1

Water
8.25 GPM[1]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Air90-100 PSI[1]
  • Typevacuum evaporator[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What type of equipment is the CHA MPS 4-20 C Vacuum?

The CHA MPS 4-20 C Vacuum is a vacuum evaporator.[2][1]

What process category does the CHA MPS 4-20 C Vacuum belong to?

The CHA MPS 4-20 C Vacuum belongs to the deposition category.[2][3]

What water flow does the CHA MPS 4-20 C Vacuum require?

The CHA MPS 4-20 C Vacuum requires water at 8.25 GPM.[1][2]

Not publicly documented

The following facts about the MPS 4-20 C Vacuum are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MPS 4-20 C Vacuum are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the MPS 4-20 C Vacuum are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the MPS 4-20 C Vacuum are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the MPS 4-20 C Vacuum are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the MPS 4-20 C Vacuum is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]waferpedia.com — waferpedia.comwaferpedia.com
  3. [3]CHA MPS 4-20 C Vacuum family | Waferpedia — waferpedia.comwaferpedia.com
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Last updated Oct 19, 2026.

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