CyberOptics
The CyberOptics SE500-II is a 3D solder paste inspection system. The CyberOptics SE500-II has a maximum board size of 510 x 510 mm. The CyberOptics SE500-II has an inspection speed of 80 cm²/sec at 30 µm.[1]

Solder paste inspection systems are metrology and inspection tools used in electronics assembly to measure deposited solder paste on printed circuit boards before component placement. Solder paste inspection systems generally verify deposit presence, position, and volumetric quality so paste-printing issues can be detected before later assembly steps propagate defects.
Solder paste inspection systems generally image the printed board after stencil printing and compare measured paste deposits against programmed references and tolerances. Solder paste inspection systems typically use board fiducials to register position, then scan paste features across the panel and report defects for operator review or line control. Solder paste inspection systems often exchange measurement results with upstream printing controls and downstream assembly systems so process corrections can be applied.
Solder paste inspection systems are placed after solder paste printing and before component placement in an SMT assembly line. Solder paste inspection systems serve as an early process control step that screens for printing defects before reflow and final optical or x-ray inspection.
The SE500-II is intended for solder paste inspection in electronics assembly inspection. The SE500-II supports closed loop feedback and mounter feed forward integration features for line use.[1][4]
Documented failure modes, common issues, and field considerations.
The machine is identified as 2015 CyberOptics SE500-II in one source.
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The CyberOptics SE500-II is a solder paste inspection system.[1]
The following facts about the SE500-II are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented variants, configuration options, or revision breakpoints of the SE500-II are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the SE500-II are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the SE500-II is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the SE500-II are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the SE500-II are on record.
Answerable by: university cleanroom staff or an OEM application specialist
Last updated Oct 20, 2026.
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