Denton Vacuum
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The Denton Explorer 14 RF Sputterer is an RF sputterer.[1]
RF sputterers are physical vapor deposition systems used to deposit thin films of insulating and conducting materials.
In RF sputtering, a target material is bombarded with ions from a plasma sustained by a radio-frequency electric field.
The target atoms are ejected and deposited on a substrate placed in the vacuum chamber.
Sputter deposition is typically used after photolithography to deposit thin films for interconnects, contacts, and passivation layers.
The process can be part of front-end or back-end fabrication steps depending on the material being deposited.
Applications include deposition of metal films for electrodes, dielectric films for capacitors, and magnetic films for data storage.
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The following facts about the Explorer 14 RF Sputterer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the Explorer 14 RF Sputterer are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Explorer 14 RF Sputterer are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Explorer 14 RF Sputterer are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Explorer 14 RF Sputterer are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Explorer 14 RF Sputterer are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Last updated Aug 14, 2026.
The Oxford 100 Nitride is a deposition system manufactured by Oxford Instruments for depositing nitride layers.