Disco
DAG 810 Back
The Disco DAG 810 is a back grinder used for semiconductor wafer backside grinding. The Disco DAG 810 supports 6-inch wafers. The Disco DAG 810 is a 3-phase machine operating at 50/60 Hz.[1][2][3][4]
What it is
General reference — not yet source-verifiedBack grinders are wafer thinning tools used in semiconductor manufacturing. Back grinders remove material from the back side of a wafer after front side device fabrication so the wafer reaches a target thickness for later assembly and packaging. Back grinding is part of the broader back end flow that prepares wafers for singulation and device integration.
How it works
General reference — not yet source-verifiedBack grinding uses a rotating abrasive wheel to remove silicon from the back side of a mounted wafer. Back grinding generally holds the wafer on a chuck while controlled feed, spindle motion, and coolant management support material removal and surface quality. Back grinding is typically followed by cleaning and sometimes stress relief or polishing steps to reduce subsurface damage from the grind.
Where it fits in the process flow
General reference — not yet source-verifiedBack grinders are used after most front side wafer processing is complete and before singulation. Back grinding commonly takes place after the wafer front side has been protected with tape or another temporary support method. Back grinding prepares the wafer for downstream dicing, die attach, stacked assembly, and other packaging flows that benefit from thinner substrates.
Applications
General reference — not yet source-verifiedBack grinding is used when semiconductor devices need reduced wafer thickness for packaging and assembly. Back grinding supports applications where thinner die help package height, thermal behavior, or integration in compact electronic products. Back grinding is also used before dicing when the process flow requires die from a thinned wafer.
What do the numbers mean?
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Strasbaugh 7 AF Back— Same function class: Dicing & Grinding, nullCompare in depthsource[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
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Frequently asked questions
Not publicly documented
The following facts about the DAG 810 Back are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAG 810 Back are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DAG 810 Back are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DAG 810 Back are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DAG 810 Back are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DAG 810 Back is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (7)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Equipment inventory listing
- [4]inventory listing
- [5]Inventory photo
- [6]Inventory photo
- [7]Inventory photo
Last updated Oct 16, 2026.
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