Disco

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The equipment is a Disco DFG 8760 / DFM 2700 In-Line Wafer Grinder / Lapper / Polisher.[2][1]
The DFG 8760 is a 3 Axis Dry Polishing Type 2 machine, with Z1 and Z2 grinding spindles and a Z3 polishing spindle.[1]
The following facts about the DFG 8760 DFM 2700 In-Line Wafer Grinder Lapper are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFG 8760 DFM 2700 In-Line Wafer Grinder Lapper are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFG 8760 DFM 2700 In-Line Wafer Grinder Lapper are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFG 8760 DFM 2700 In-Line Wafer Grinder Lapper are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFG 8760 DFM 2700 In-Line Wafer Grinder Lapper are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFG 8760 DFM 2700 In-Line Wafer Grinder Lapper is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Aug 14, 2026.
The Logitech 1 DP 41 is a polisher with 3-phase, 50/60 Hz, 480 V, 12 amp electrical requirements.