Disco DFL

Models in this family

1. 

   DFL 7161 FX
2. 

   DFL 7361

   The Disco DFL 7361 is a laser saw with a Type FX laser head, BSS-6 optics system, and integrated wafer cleaning system with atomizing nozzle.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   SECS/GEM Software	—	—	Listed as an option.	Equipment inventory listing[1]
   Intemal lighting	—	—	Listed as an option.	Equipment inventory listing[1]
   Virus-free PC	—	—	Listed as an option.	Equipment inventory listing[1]
   STM DFL7161 2021 SW unified	—	—	Listed as an option.	Equipment inventory listing[1]
   Barcode reading function for auto recipe loading	—	—	Listed as an option.	Equipment inventory listing[1]
   Compatibility with Hogomax 5L tanks	—	—	Listed as an option.	Equipment inventory listing[1]
   Change of Laser Focus Position for Maintenance	—	—	Listed as an option.	Equipment inventory listing[1]
   Additional Kerf check sequence	—	—	Listed as an option.	Equipment inventory listing[1]
   Password Modification up to Level 4	—	—	Listed as an option.	Equipment inventory listing[1]
   Disco CO2 Injector + Integration specs	—	—	Listed as an option.	Equipment inventory listing[1]
   CO2 injector (stand-alone) added	—	—	Listed as an option.	Equipment inventory listing[1]
   Addition of drain valve for CO 2 injector specific resistance value stabilization	—	—	Listed as an option.	Equipment inventory listing[1]
   CO2 water target resistivity value Settable in device data	—	—	Listed as an option.	Equipment inventory listing[1]
   CO2 bubbler support (RS232C)	—	—	Listed as an option.	Equipment inventory listing[1]
   New version Zxis assembly for DFL7161 with higher rigidity specs (standard for STM)	—	—	Listed as an option.	Equipment inventory listing[1]

3. 

   DFL 7560 L

   The Disco DFL 7560 L is a laser saw with robot wafer handling, stated for 2-inch to 4-inch wafers.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   200mm Fully Automatic wafer handling from/to standard wafer cassette	—	—	Machine modification includes 200mm fully automatic wafer handling from/to standard wafer cassette, chuck for 200mm wafers, new robot design for handling heavier wafers, new CE marking, 6 inch lens, and new Galvo Scanner.	Equipment inventory listing[2]

Sources