Disco
DGP 8761
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
General reference — not yet source-verifiedCMP equipment is used to planarize wafer surfaces by combining mechanical action with chemical action at the wafer interface. CMP tools are part of wafer surface finishing and are used when a process flow requires a flatter surface before later patterning, deposition, or integration steps.
How it works
General reference — not yet source-verifiedCMP systems generally press a wafer against a moving polishing surface while slurry chemistry and pad mechanics remove material in a controlled manner. CMP systems generally rely on tightly managed consumable condition, relative motion, and process time to balance removal rate, planarity, and surface quality.
Where it fits in the process flow
General reference — not yet source-verifiedCMP sits in the wafer fabrication flow where a surface must be flattened or thinned before subsequent processing. CMP is commonly placed between film formation and later lithography or integration operations when topography control is important.
Applications
General reference — not yet source-verifiedCMP equipment is used for surface planarization and finishing on semiconductor wafers and related substrates. CMP processes are applied where film stacks or substrate surfaces require improved flatness, thickness control, or preparation for later device-making steps.
What do the numbers mean?
Power & electrical2
Control & software1
Configuration & options14
- Inline DFM 2800 mounter / detaper[2]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the Disco DGP 8761?
The Disco DGP 8761 is a polisher.[1]
Not publicly documented
The following facts about the DGP 8761 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DGP 8761 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DGP 8761 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DGP 8761 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DGP 8761 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DGP 8761 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (7)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]Inventory photo
- [7]web.archive.org — disco.co.jp (Dec 11, 2017)web.archive.org
Last updated Oct 18, 2026.
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