Waferpedia

Tool family

Disco DGP 8761

DiscoDicing & Grinding4 entries
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Models in this family

  1. DGP 8761
  2. DGP 8761 + DFM 2800 In-Line

    Disco DGP 8761 + DFM 2800 In-Line Grinder is a fully automatic in-line grinder configured for 200 mm and 300 mm wafers.

  3. DGP 8761 DFM 2800

    Cited variants

    DesignationGenerationVintageChangesSource
    DGP 8761 / DFM 2800—2012–2020Sources state different vintages and different wafer-size/configuration details across listings.Equipment inventory listing[1]
  4. DGP 8761 DFM 2800 Back

All entries

  1. DGP 8761Disco
    CategoryCMP
    1 spec
  2. DGP 8761 + DFM 2800 In-LineDisco

    Disco DGP 8761 + DFM 2800 In-Line Grinder is a fully automatic in-line grinder configured for 200 mm and 300 mm wafers.

    CategoryDicing & Grinding
    20 specs
  3. DGP 8761 DFM 2800Disco
    CategoryCMPWaferWafer Notch Visual Monitoring Alignment Option
    25 specs
  4. DGP 8761 DFM 2800 BackDisco
    CategoryDicing & GrindingWafer2 Independent loadports, 25 wafer front opening unified pod (FOUP) carrier
    20 specs

Sources

Sources (1)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing