Disco
The Disco F DFP 8160 Fully Automated is a fully automated polisher. The Disco F DFP 8160 Fully Automated is specified for 8-inch to 12-inch wafers. The Disco F DFP 8160 Fully Automated has a spindle max. revolution of 3000min.[1][2]

The Disco F DFP 8160 Fully Automated has a maximum spindle revolution of 3000 min. The Disco F DFP 8160 Fully Automated requires air at 0.5 MPa with 550 L/min (ANR). The Disco F DFP 8160 Fully Automated also specifies cutting water at 0.3 MPa and 20 L/min, plus cooling water at 0.2 MPa and 4 L/min.[2][1]
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The Disco F DFP 8160 Fully Automated requires 200 VAC three-phase power at 50/60 Hz. The Disco F DFP 8160 Fully Automated has a full-load current of 57 A.[2][1]
The Disco F DFP 8160 Fully Automated has a maximum spindle revolution of 3000 min.[2][1]
The following facts about the F DFP 8160 Fully Automated are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the F DFP 8160 Fully Automated are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the F DFP 8160 Fully Automated are on record.
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The control-system platform and OS era of the F DFP 8160 Fully Automated are not on record.
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No publicly documented failure modes or field errata for the F DFP 8160 Fully Automated are on record.
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The process node or technology generation of the F DFP 8160 Fully Automated is not on record.
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Last updated Oct 15, 2026.
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