Esec 2100

Models in this family

1. 

   2100 FC Flip Chip

   The Esec 2100 FC is a flip chip bonder.

2. 

   2100 HS
3. 

   2100 XP

   The Esec 2100 XP is a die bonder rated at 240 V, 50/60 Hz, single phase, with a full load power of 2300 VA.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   2100 xP	—	—	Described as Esec’s latest die attach platform; presented as a revolutionary die bonder.	web.archive.org[1]

Sources