2100 XP

The Esec 2100 XP is a die bonder used for semiconductor packaging and bonding. The Esec 2100 XP is part of Esec's epoxy die bonder product line. The Die Bonder 2100 xP was formally launched in May 2008 at SEMICON in Singapore. The Die Bonder 2100 xP received the Swiss Technology Award in 2008.^[4][5][1]

The Die Bonder 2100 xP picks unprotected dies from a wafer and affixes them to a substrate material with adhesive or solder. The Die Bonder 2100 xP performs this pick-and-place task at four chip placements per second with a precision of 5 μm. The Die Bonder 2100 xP uses a machine layout based on smooth rotational movement rather than a conventional three-step angular pick-and-place motion. The Die Bonder 2100 xP was developed to increase productivity by more than 80% relative to conventional solutions.^[1]

Die bonding sits in semiconductor assembly after wafer fabrication and singulation and before later package completion steps. Die bonding creates the physical attachment between the semiconductor die and the package substrate or leadframe so that subsequent interconnect and encapsulation operations can proceed.

Die bonders are used where bare semiconductor die must be attached to a package element before electrical interconnection and enclosure. Die bonders support package assembly flows that require controlled die placement onto prepared attachment sites.