Heidelberg Instruments
MLA150
Plate 01Heidelberg MLA150 Training - Pritzker Nanofabrication Facility
Anna MukhortovaWatch on YouTubePlate 02Multilayer lithography with the Maskless Aligner MLA150
Nano Vacuum Pty LtdWatch on YouTubePlate 03Photolithography without a mask: Multilayer lithography with the Maskless Aligner MLA 150
Heidelberg InstrumentsWatch on YouTubePlate 04Extract from EPFL User Interview: MLA 150 at the Center of MicroNanoTechnology (CMi) at EPFL
Heidelberg InstrumentsWatch on YouTubePlate 05MLA 150 Anniversary – Gregg Moore Shares a Story
Heidelberg InstrumentsWatch on YouTubePlate 06ASU Core Facilities Equipment Showcase: Heidelberg MLA 150
Arizona State University ResearchWatch on YouTube
What it is
How it works
Where it fits in the process flow
General reference — not yet source-verifiedThe MLA150 sits in the lithography section of a microfabrication flow, where it is used after resist coating and before development, etching, plating, or other downstream pattern transfer steps. It is used when a maskless exposure step is preferred for flexible pattern definition and alignment.
Applications
The MLA150 is used for direct patterning of photolithographic structures in semiconductor processing, MEMS, micro-optics, sensors, actuators, MOEMS, materials research, life science, and related nanofabrication work.[1][4]
It is used with standard I-line photoresists and supports applications that benefit from grayscale profiles, high aspect ratio resist structures, backside alignment, and rapid exposure of small to medium substrates.[3][4][2]
- Direct writing of patterns onto wafers
- Fast patterning of masks and wafers
- Life Science
- MEMS
- Micro-Optics
- Semiconductor
- Sensors
- Actuators
- MOEMS
- Material Research
- Nano-Tubes
- Graphene
Why won't it start?
Documented failure modes, common issues, and field considerations.
- The source states a risk of crashing the writehead on small chips if the loading procedure is not followed accurately.
- The source states the equipment is sensitive to airborne solvent contamination on optical elements.
- The source states the sample must contain at least a 5 x 5 mm square for pneumatic autofocus to work correctly.
What do the numbers mean?
Wafer handling3
Optics & imaging6
- Exposure time at maximum write speed
- 9 minutes for 100 x 100 mm2; 16 minutes for 150 x 150 mm2[1]
Performance2
Configuration & options4
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| MLA150 - 1 | — | — | Listed as one of the MLA150 system entries; source provides separate specifications for this unit. | epfl.ch[2] |
| MLA150 - 2 | — | — | Listed as one of the MLA150 system entries; source provides separate specifications and grayscale/high aspect ratio options for this unit. | epfl.ch[2] |
| MLA150-1 | — | — | Maximum substrate size 220 x 220 x 8 mm; 375 nm laser power 2800 mW; writing time with 375 nm laser on a 100 mm wafer is < 32 min (Fast mode). | epfl.ch[2] |
| MLA150-2 | — | — | Maximum substrate size 200 x 200 x 12 mm; 375 nm laser power 7200 mW; writing time with 375 nm laser on a 100 mm wafer is < 9 min (Fast mode); includes high aspect ratio and grayscale lithography features. | epfl.ch[2] |
Where are the manuals?
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
- UG07 Conversion Software Guide (APP) - MLA 150 [01424].pdfDocumentumd.edu
- UG08 Design Creation Guide - MLA 150 [01424].pdfDocumentumd.edu
- UG11 Grayscale Guide - MLA 150 [01424].pdfDocumentumd.edu
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the MLA150 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MLA150 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the MLA150 are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the MLA150 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the MLA150 are on record.
Answerable by: an OEM parts catalog or a service engineer
Sources & citations
Sources (7)Every fact above is drawn from these public sources
- [1]pnf.uchicago.edu — pnf.uchicago.edupnf.uchicago.edu
- [2]epfl.ch — epfl.chepfl.ch
- [3]Maskless Aligner (Heidelberg MLA150) - UCSB Nanofab Wiki — wiki.nanotech.ucsb.eduwiki.nanotech.ucsb.edu
- [4]Tool Details - Harvard CNS — cns1.rc.fas.harvard.educns1.rc.fas.harvard.edu
- [5]UG07 Conversion Software Guide (APP) - MLA 150 [01424].pdf — nanocenter.umd.edunanocenter.umd.edu
- [6]UV direct write [HEIDELBERG-MLA] | Quantum-Nano Fabrication and Characterization Facility | University of Waterloo — uwaterloo.cauwaterloo.ca
- [7]Systemingenieur (m/w) für Laserlithographie-Systeme — himt.de (Aug 25, 2019)web.archive.org
Last updated Jul 29, 2026.
