Hitachi
CM 700
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Hitachi CM 700 is a die bonder. The Hitachi CM 700 belongs to the Packaging & Bonding equipment category. The Hitachi CM 700 family includes the CM 700 H variant.[1][2]
What it is
How it works
General reference — not yet source-verifiedA die bonder picks a die from a wafer and places it onto a substrate. The bonder applies adhesive or solder to secure the die. Bonding methods available for this class of equipment include epoxy, eutectic, and solder.
Where it fits in the process flow
General reference — not yet source-verifiedDie bonders operate in the back-end semiconductor assembly process. The machines follow wafer dicing and precede wire bonding or encapsulation.
Applications
General reference — not yet source-verifiedDie bonders are used in assembling integrated circuits, discrete semiconductors, and power devices. The equipment handles various die sizes and substrate types.
What do the numbers mean?
Configuration & options4
- parts machine[3]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| CM 700 H | — | — | The Hitachi CM 700 H is a die bonder. | waferpedia.com[2] |
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the CM 700 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the CM 700 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the CM 700 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the CM 700 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the CM 700 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the CM 700 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]waferpedia.com — waferpedia.comwaferpedia.com
- [2]waferpedia.com — waferpedia.comwaferpedia.com
- [3]inventory listing
- [4]Equipment inventory listing
Last updated Oct 11, 2026.
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