Koh Young
Provisional entry — research in progress
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The Koh Young KY 3020 T is a three-dimensional solder paste inspection system.[1]
Three-dimensional solder paste inspection systems project a structured light pattern onto the solder paste. A camera captures the image of the deformed pattern, and software algorithms calculate the height, volume, and area of each deposit. The system compares the measured values against predefined tolerances to flag defects.
In an automatic surface-mount assembly line, the solder paste inspection system is placed after the solder paste printer and before the pick-and-place machines. The system validates the print quality before components are placed, allowing early detection of printing defects.
Solder paste inspection systems are used in electronics manufacturing for quality control of the solder paste printing process. The data collected can be used for process monitoring and optimization.
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3D solder paste inspection.[1]
The following facts about the KY 3020 T 3D are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the KY 3020 T 3D are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the KY 3020 T 3D are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the KY 3020 T 3D are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the KY 3020 T 3D are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the KY 3020 T 3D is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Aug 20, 2026.
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