Lam Research
2300 e 4 Exelan GX
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Lam 2300 e 4 Exelan GX is an etcher used in semiconductor manufacturing.[1]
What it is
General reference — not yet source-verifiedPlasma etch systems of this class are used for removing dielectric material from semiconductor wafers during integrated circuit fabrication. The Exelan GX is a dielectric etcher designed for mature-node and legacy process flows.
How it works
General reference — not yet source-verifiedThe 2300 e 4 Exelan GX employs a capacitively coupled plasma (CCP) reactor. Radio-frequency power is applied to electrodes to generate a plasma from process gases introduced into the chamber.
The plasma produces energetic ions and reactive radicals that etch dielectric films such as silicon dioxide and silicon nitride. The system typically uses dual-frequency RF excitation to control ion energy and plasma density independently.
Where it fits in the process flow
General reference — not yet source-verifiedDownstream steps following dielectric etch include photoresist stripping, wet cleaning, and metal deposition or CMP. The tool is typically deployed in the front-end-of-line and middle-of-line modules for interlayer dielectric patterning.
Applications
General reference — not yet source-verifiedCommonly etched materials include silicon dioxide, silicon nitride, and low-k dielectrics. The system handles high-aspect-ratio features typical of mature-node technologies.
What do the numbers mean?
No specifications recorded yet
Be the first to add cited specifications for this tool.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the 2300 e 4 Exelan GX are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the 2300 e 4 Exelan GX are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2300 e 4 Exelan GX are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 2300 e 4 Exelan GX are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 2300 e 4 Exelan GX are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2300 e 4 Exelan GX are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
Last updated Aug 22, 2026.