Lam Research
2300 Exelan Flex Dielectric
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Lam 2300 Exelan Flex is a dielectric etch system. The Lam 2300 Exelan Flex is designed for sub-90nm technology nodes. The Flex variant adds a 60MHz ICP source for low-k etch at sub-65nm nodes.[1][2][3][4]
What it is
General reference — not yet source-verifiedDielectric etch systems are plasma processing tools used to remove insulating films from semiconductor wafers in a controlled pattern. Dielectric etch systems commonly operate after lithography has defined a mask and before later deposition, clean, or fill steps continue device fabrication. Dielectric etch systems are part of the dry etch segment of wafer fabrication equipment.
Where it fits in the process flow
General reference — not yet source-verifiedDielectric etch tools are used after a patterned masking step has exposed selected areas of an insulating film. Dielectric etch tools then transfer that pattern into the underlying dielectric layer so that later process steps can form openings, trenches, or isolation features. Dielectric etch tools therefore sit between pattern definition and subsequent stripping, cleaning, barrier, fill, or deposition operations in a wafer process flow.
Applications
General reference — not yet source-verifiedDielectric etch tools are commonly applied to insulating films used for isolation, interlayer pattern transfer, and the formation of etched openings needed for later integration steps. Dielectric etch tools can be configured in production lines for films such as oxide and other nonconductive layers, depending on process chemistry and chamber setup.
Why won't it start?
Documented failure modes, common issues, and field considerations.
- Used Exelans lack modern diagnostics like in-situ OES monitoring.
What do the numbers mean?
Power & electrical1
Wafer handling1
Configuration & options6
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| 2300 Exelan HP (High Productivity) | — | — | Uses 13.56MHz ICP source with 3000W max power; ideal for oxide etch at 90nm. May lack 60MHz ICP for low-k etch. | caladansemi.com[1] |
| Exelan Classic (pre-2005) | — | — | Pre-2005 variant; lacks sub-100nm uniformity. Avoid for sub-100nm nodes. | caladansemi.com[1] |
| Exelan HP | — | 2003 | The HP variant is described as high productivity and uses a 13.56 MHz ICP source with 3000 W max power. | caladansemi.com[1] |
| Exelan Flex | — | 2003 | The Flex variant is described as adding 60 MHz ICP for sub-65 nm low-k etch. | caladansemi.com[1] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- ICP source frequency13.56MHz for Exelan HP; 60MHz for Flex variant[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the Lam Research 2300 Exelan Flex?
The Lam Research 2300 Exelan Flex is a semiconductor manufacturing tool classified as a dielectric etch system.[2][3][1]
What power source does the Exelan Flex use?
The Exelan Flex uses an inductively coupled plasma (ICP) source. The Flex variant adds a 60 MHz ICP.[1]
What are the main components maintained in the vacuum chamber?
Maintained components in the vacuum chamber include the chamber liners, the e-chuck, heater coils, and the heater plate.[5]
What dielectric materials can the system etch?
The system is used for etching oxide, nitride, and low-k dielectric materials.[1]
Not publicly documented
The following facts about the 2300 Exelan Flex Dielectric are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2300 Exelan Flex Dielectric are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 2300 Exelan Flex Dielectric are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the 2300 Exelan Flex Dielectric is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 2300 Exelan Flex Dielectric are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the 2300 Exelan Flex Dielectric are on record.
Answerable by: university cleanroom staff or an OEM application specialist
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]caladansemi.com — caladansemi.comcaladansemi.com
- [2]Equipment inventory listing
- [3]fabsurplus.com — fabsurplus.comfabsurplus.com
- [4]fabsurplus.com — fabsurplus.comfabsurplus.com
- [5]https://www.foamtecintlwcc.com/wp-content/uploads/2023/09/lam-2300-flex-oxide-etch.pdf — foamtecintlwcc.comfoamtecintlwcc.com
Last updated Oct 16, 2026.
Compare with similar tools
View all →The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.
