Kalos HEX

Test systems of this class are semiconductor electronic test platforms used to apply electrical stimuli to devices and measure the resulting responses. Test systems of this class are commonly paired with handlers or probers so that packaged parts or wafers can be presented to the tester for automated measurement.

Semiconductor testers of this class drive signals and power conditions into a device under test, capture electrical responses, and compare the measured behavior with expected limits. Probe-based configurations contact pads on wafers through a probe card, while packaged-device configurations contact leads or terminals through an interface connected to automated part handling.

Electrical test equipment of this class sits after device fabrication and supports verification before later assembly or shipment steps. Wafer probe is used after front-end processing to screen die on the wafer, and final test is used after packaging to confirm device function and parametric behavior.

Test and probe systems of this class are used for production screening, characterization, and fault isolation of semiconductor devices. Test and probe systems of this class are applied where a process flow requires electrical confirmation of device functionality, continuity, timing behavior, or other parametric results before the next manufacturing stage.