Nova
Plate 01STAR CITIZEN 600i REWORK NEWS!
Plate 02The Most HYPED Rework - Origin 600I - Star Citizen
Plate 03Star Citizen: Nova vs 600i
Plate 04Nova I Bike I Benelli TNT 600I 2023 I Black Edition I Benelli 600I Stock Exhaust Sound
Plate 05Origin 600i Explorer Review – Strengths, Weaknesses & Full Tour!
Plate 06Star Citizen: 600i, Zeus, Knox, & Nova Updates! #shorts
Plate 07Star Citizen 3.24.3 - 10 Minutes More or Less Ship Review - ORIGIN 600i EXPLORER
Plate 08An Architect Reviews the 600i - Star Citizen
Plate 09Origin 600i Comparison - Which one do YOU prefer?
Plate 10FEI Helios Nanolab 600i dual FIB/SEM: full SEM column bakeout (with glitches and workarounds)
The FEI Nova 600i is a DualBeam system that combines a focused ion beam (FIB) column with a field-emission scanning electron microscope (SEM). The system is designed for nanoscale prototyping, machining, characterization, and analysis of structures below 100 nanometers. The Nova 600i is the successor to the Nova 600 NanoLab. The tool integrates advanced beam chemistries for deposition and etch, and includes a PC-controlled nanometer-resolution manipulator. The system is used for TEM sample preparation, circuit edit, defect analysis, and nanofabrication.[1][3][2]
The Nova 600i uses a Sidewinder ion column with a gallium liquid metal ion source for the FIB, and a Sirion Schottky thermal field emitter for the SEM. The electron and ion columns are arranged at an angle of 52 degrees, meeting at a fixed coincidence point at a working distance of 5 mm. The system includes an in-lens detector for secondary and backscattered electrons, an Everhardt‑Thornley secondary electron detector, and an optional STEM detector. The instrument features a five-axis motorized stage with 150 mm X‑Y travel, piezo-driven, and a tilt range from -10 to +60 degrees. The vacuum system consists of one turbomolecular pump, one dry pump, and three ion getter pumps.[2]
The Nova 600i uses a gas injection system (GIS) capable of supporting up to four injectors for deposition of materials such as platinum, tungsten, and silicon dioxide, as well as for selective etching. The system operates in a dual-beam geometry that allows simultaneous patterning and imaging (SPI) for real-time monitoring of the milling process. The patterning engine is a 16‑bit digital pattern generator for creating complex three‑dimensional shapes.[2]
Dual‑beam FIB‑SEM systems such as the Nova 600i are used in semiconductor fabrication for failure analysis, defect review, circuit edit, and TEM lamella preparation. The system can be employed for cross‑sectioning and imaging of structures, as well as for preparing thin samples for transmission electron microscopy. The instrument also supports nanofabrication tasks such as nanomilling, ion‑beam deposition, and prototyping of MEMS and photonic devices.[1][4][3][2]
Process applications and technology nodes documented for this tool.
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The electron beam resolution is 1.1 nm at 15 kV at optimum working distance, and 2.5 nm at 1 kV. At the coincidence point (5 mm WD), the resolution is 1.5 nm at 15 kV and 2.0 nm at 5 kV.[2]
The ion beam resolution at the coincidence point is 7.0 nm at 30 kV, with 5.0 nm achievable.[2]
The electron column uses a Schottky thermal field emitter. The ion column uses a gallium liquid metal ion source.[2]
The maximum sample diameter is 150 mm with full rotation, and the maximum sample thickness is 20 mm.[2]
Standard detectors include an in-lens detector (TLD) for secondary and backscattered electrons, an Everhardt‑Thornley secondary electron detector, and an IR camera for viewing. A CDEM detector for secondary electron and secondary ion imaging is optional, as is a STEM detector.[2]
The following facts about the 600i are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 600i are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 600i are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 600i are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 600i are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 600i is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Aug 13, 2026.
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