Orbotech
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Orbotech Ultra Fusion 300 uses Multi-Image technology, which simultaneously acquires multiple images using different illumination sources.[1]
The system employs a patented LED-based illumination system that provides dome-shaped, uniform light coverage.[1]
The machine performs inspection using different lights and from different angles, illuminating the panel with different wavelengths to classify materials such as clean copper, oxidized copper, dust, and laminate.[1]
The Orbotech Ultra Fusion 300 performs after the PCB or IC substrate is manufactured with copper features, to detect defects such as shorts, opens, nicks, protrusions, pinholes, and minimum line/space violations.[1]
The system includes on-line verification capabilities and supports verification and repair stations such as the Orbotech VeriSmart, VeriWide, and VeriFine series, which allow operators to inspect and correct flagged defects.[1]
The Orbotech Ultra Fusion 300 inspects IC substrates such as FC-BGA, PBGA, FC-CSP, and COF panels, as well as inner and outer layers of PCBs including signal, power, ground, mixed, cross shielding, and buildup layers.[1]
The machine is used for inspecting build-up layers such as laservias (conformal and non-conformal masks) and can handle materials including bare copper, etched additive or plated copper, reverse treated foil, double-treated copper, gold-plated conductors, and substrates like FR4, Teflon, Rogers, polyimide, and ABF.[1]
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The following facts about the Ultra Fusion 300 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Ultra Fusion 300 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Ultra Fusion 300 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Ultra Fusion 300 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Ultra Fusion 300 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Ultra Fusion 300 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Aug 21, 2026.
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