Plasma-Therm
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The Plasma-Therm Core Interface is a PECVD system. The Plasma-Therm Core Interface is manufactured by Plasma-Therm. The Plasma-Therm Core Interface model name is Core Interface.[1][2]
The Plasma-Therm Core Interface is a plasma-enhanced chemical vapor deposition system.[1][2]
PECVD equipment is used in wafer fabrication after surfaces have been prepared for film growth and before later patterning, etch, implant, or metallization steps that depend on the deposited layer. PECVD tools commonly support module sequences in which a deposited film serves as a dielectric, passivation layer, barrier-related layer, or process support layer for subsequent fabrication.
PECVD systems are applied to thin-film formation for semiconductor and related microfabrication work. PECVD processes are commonly used for dielectric and passivation films, along with other functional layers needed for insulation, surface protection, masking, or interface engineering.
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PECVD stands for plasma-enhanced chemical vapor deposition.[1][2]
The Core Interface is manufactured by Plasma-Therm.[1]
The model name is Core Interface.[1]
The following facts about the Core Interface are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Core Interface are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Core Interface are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Core Interface are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Core Interface are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Core Interface is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 20, 2026.
The Applied Materials 0010-13622 is an RF match unit intended for PVD (Physical Vapor Deposition) described as a High Efficiency HE RF Match-Bias.
The Applied Materials 0020 12458 Part is an insulator, side match component for the Hdp-Cvd Ultima Plus system.