Rudolph
3Di
What is it?
What can it run?
Process applications and technology nodes documented for this tool.
- Bumped device manufacturing
- 3D bump inspection and metrology
- 2D bump inspection and metrology
- Under bump metalization (UBM)
- Pre- and post-reflow inspection
- Wafer level packaging inspection
- Redistribution lines inspection
- Thick films inspection
- Vias inspection
- Intermediate interconnects inspection
What do the numbers mean?
Wafer handling3
- Inspection capabilities
- Complete high-throughput, high-accuracy, 100% bump and wafer inspection in one system[1]
- Application flexibility
- All bump processes and materials; under bump metalization (UBM); pre- and post-reflow; other wafer level packaging inspection including redistribution lines, thick films, vias, and intermediate interconnects[1]
Configuration & options2
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the 3Di are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 3Di are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 3Di are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 3Di are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 3Di are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 3Di is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
Last updated Jul 29, 2026.
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