AS 2000

The SCREEN AS 2000 is a chemical mechanical polisher used in semiconductor manufacturing. The SCREEN AS 2000 handles 8 inch wafers.^[1][2][3]

Chemical mechanical polishing combines abrasive slurry action with controlled mechanical contact to planarize and condition wafer surfaces. CMP tools typically rotate the wafer against a polishing surface while metering chemistry to remove material in a controlled way. CMP modules are commonly paired with post polish cleaning functions that remove slurry residue and particles before the wafer moves to later steps.

CMP tools are used after film deposition when a wafer surface must be leveled or prepared for subsequent patterning, deposition, cleaning, or metrology. CMP sits in the middle of front end and interconnect process flows wherever topography control and surface finish affect later lithography, etch, fill, or inspection results.

CMP systems are used to planarize dielectric, metal, and other deposited layers in semiconductor processing. CMP systems are also used to reduce surface nonuniformity, remove excess material after fill processes, and prepare wafers for later fabrication steps that require a flatter surface.