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Applied Materials

Reflexion

CMPApplied Materials Reflexion family
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Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Applied Materials Reflexion is a chemical mechanical polisher (CMP) for semiconductor wafer polishing. The Applied Materials Reflexion CMP is built for processing 12-inch wafers. Applied Materials Reflexion units were configured for processing materials such as dielectric and oxide, copper, and metals including cobalt.[1][2][3]

Reflexion — Inventory photo
Fig. 01ReflexionInventory photo[4]

How it works

A chemical mechanical polishing apparatus uses a substrate carrier or polishing head to hold a substrate against a polishing pad mounted on a platen. A carrier assembly applies controllable pressure to the substrate against the polishing pad. An external driving force moves the polishing pad relative to the substrate. A chemical mechanical polishing apparatus disperses a polishing composition or slurry during polishing to provide both chemical activity and mechanical activity. The polishing motion generates heat at the wafer and pad interface.[5]

Where it fits in the process flow

Chemical mechanical polishing is used after film deposition and pattern formation have created excess topography on the wafer. Chemical mechanical polishing can remove deposited material above filled features and create an even surface for subsequent patterning processes. Chemical mechanical polishing also helps remove unwanted roughness, scratches, contaminated layers, and other surface defects from previously deposited material.[5]

What do the numbers mean?

Wafer handling2

Wafer Sizes
12 inch[1]
Accurate?
Wafer Size
12 inch[1]
Accurate?

Gas & chemistry3

Process Type
Chemical Mechanical Polishing (CMP)[1]
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Category
CMP (Chemical Mechanical Polisher)[1]
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Equipment type
CMP (Chemical Mechanical Polisher)[1]
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Configuration & options8

Dielectric, LK Oxide[1]
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Copper[2]
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Metal, Cobalt[3]
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OEM
Applied Materials[1]
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Model
Reflexion[1]
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Variant
12" Dielectric, LK Oxide[1]
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Variant
12" Copper[2]
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Variant
12" Metal, Cobalt 3 Vintage[3]
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Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
Reflexion LK——listed as a CMP system available from Applied Materialspatents.google.com[5]
Reflexion LK Prime——listed as a CMP system available from Applied Materialspatents.google.com[5]
Reflexion——Configured as 12" Dielectric, LK Oxide.Equipment inventory listing[1]
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What replaced it?

Alternatives

Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Process TypeChemical Mechanical Polishing (CMP)[1]
  • CategoryCMP (Chemical Mechanical Polisher)[1]
  • Equipment typeCMP (Chemical Mechanical Polisher)[1]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What type of equipment is the Applied Materials Reflexion?

The Applied Materials Reflexion is a chemical mechanical polisher.[1][2][3]

Not publicly documented

The following facts about the Reflexion are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Reflexion are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the Reflexion are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Reflexion are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Reflexion is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the Reflexion are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]Inventory photo
  5. [5]patents.google.com — patents.google.compatents.google.com
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Last updated Oct 16, 2026.

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