Applied Materials
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The Applied Materials Reflexion is a chemical mechanical polisher (CMP) for semiconductor wafer polishing. The Applied Materials Reflexion CMP is built for processing 12-inch wafers. Applied Materials Reflexion units were configured for processing materials such as dielectric and oxide, copper, and metals including cobalt.[1][2][3]

A chemical mechanical polishing apparatus uses a substrate carrier or polishing head to hold a substrate against a polishing pad mounted on a platen. A carrier assembly applies controllable pressure to the substrate against the polishing pad. An external driving force moves the polishing pad relative to the substrate. A chemical mechanical polishing apparatus disperses a polishing composition or slurry during polishing to provide both chemical activity and mechanical activity. The polishing motion generates heat at the wafer and pad interface.[5]
Chemical mechanical polishing is used after film deposition and pattern formation have created excess topography on the wafer. Chemical mechanical polishing can remove deposited material above filled features and create an even surface for subsequent patterning processes. Chemical mechanical polishing also helps remove unwanted roughness, scratches, contaminated layers, and other surface defects from previously deposited material.[5]
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Reflexion LK | — | — | listed as a CMP system available from Applied Materials | patents.google.com[5] |
| Reflexion LK Prime | — | — | listed as a CMP system available from Applied Materials | patents.google.com[5] |
| Reflexion | — | — | Configured as 12" Dielectric, LK Oxide. | Equipment inventory listing[1] |
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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The following facts about the Reflexion are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Reflexion are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Reflexion are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Reflexion are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Reflexion is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Reflexion are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Oct 16, 2026.
The Strasbaugh 6 EC is a chemical mechanical polishing (CMP) tool with fully programmable process parameters, supporting wafer sizes including 3-inch and 4-inch (100 mm) wafers.
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The Logitech 1 DP 41 is a polisher with 3-phase, 50/60 Hz, 480 V, 12 amp electrical requirements.
The Strasbaugh 100R16 is a 1-spindle grinder/polisher with a DC drive system and 2 motors. The Strasbaugh 100R16 has a 16-inch capacity.