STEAG
Mecapol E 460
The Alpsitec E 460 CMP tool is a semi-automatic system for the polishing and the planarization of wafers. The Alpsitec E 460 is compatible with 4", 6" and 8" wafers. The Alpsitec E 460 is equipped with 2 pumps for slurry delivery and an ex-situ conditioning system.[1]
Wafer size
4"
Vacuum
2 pumps[1]
What it is
The STEAG Mecapol E 460 is a semi-automatic system for the polishing and planarization of wafers. The STEAG Mecapol E 460 is compatible with 4 inch, 6 inch, and 8 inch wafers. The STEAG Mecapol E 460 can also process other wafer sizes or chips by bonding them to a carrier wafer. The STEAG Mecapol E 460 is equipped with 2 pumps for slurry delivery and an ex-situ conditioning system.[1][2]
How it works
The STEAG Mecapol E 460 operates by rotating the wafer against a polishing pad while slurry is dispensed onto the pad. The STEAG Mecapol E 460 uses 2 pumps for slurry delivery. The STEAG Mecapol E 460 includes an ex-situ conditioning system to maintain the polishing pad surface. The STEAG Mecapol E 460 has separate consumable sets for microelectronic layer polishing and for copper polishing.[1][2]
Where it fits in the process flow
The STEAG Mecapol E 460 is used for planarization steps in semiconductor fabrication flow. The STEAG Mecapol E 460 is typically used following deposition processes and preceding photolithography. The STEAG Mecapol E 460 is also used for silicon polishing after grinding.[1][2]
Applications
General reference — not yet source-verifiedCMP tools are used to planarize dielectric, conductor, and semiconductor surfaces. CMP tools are also used to improve surface finish, remove residual roughness, and prepare substrates for subsequent fabrication steps.
- oxide polishing
- silicon polishing
- metal polishing
- silicon, polysilicon, and nitride polishing
Why won't it start?
Documented failure modes, common issues, and field considerations.
- The source states: "This tool is not a micro-electronic compatible tool."
What do the numbers mean?
Vacuum & pumping3
Wafer handling9
Gas & chemistry2
Performance1
- Oxide polishing target
- Thermal oxide thickness range less than 500 A; removal rate 2600–2800 A/min; removal rate can be 2 to 5 times higher on deposited oxides[1]
Configuration & options8
- Consumable sets
- Two sets: one for microelectronic layers polishing and one for copper polishing[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Which wafer sizes can the STEAG Mecapol E 460 process?
The STEAG Mecapol E 460 is compatible with 4 inch, 6 inch, and 8 inch wafers. The STEAG Mecapol E 460 can also process other wafer sizes or chips by bonding them to a carrier wafer.[1][2]
Is the STEAG Mecapol E 460 semi-automatic?
The STEAG Mecapol E 460 is a semi-automatic system for the polishing and planarization of wafers.[1][2][3]
What slurry delivery and conditioning hardware does the STEAG Mecapol E 460 have?
The STEAG Mecapol E 460 is equipped with 2 pumps for slurry delivery and an ex-situ conditioning system.[1][2]
What slurry types are used on the STEAG Mecapol E 460?
The STEAG Mecapol E 460 uses 30N50 as a basic colloidal silica slurry for dielectric polishing, 30H50 as an acid colloidal silica slurry for dielectric polishing and metal slurry formulation, and 40EA50 as a basic slurry for silicon polishing that is diluted 1 to 10 with water.[1][2]
Not publicly documented
The following facts about the Mecapol E 460 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Mecapol E 460 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Mecapol E 460 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Mecapol E 460 are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the Mecapol E 460 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Mecapol E 460 are on record.
Answerable by: an OEM parts catalog or a service engineer
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]epfl.ch — epfl.chepfl.ch
- [2]waferpedia.com — waferpedia.comwaferpedia.com
- [3]STEAG Mecapol E 460 family | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 20, 2026.
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