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The Plasma-Therm Versaline is a semiconductor processing platform used for plasma-enhanced chemical vapor deposition (PECVD) and deep reactive-ion etching (DRIE), configured for 4-inch wafers.

The Nanoscribe Photonic Professional GT+ is a 3D nanoprinter for two-photon polymerization using an infrared 780 nm femtosecond laser.

The Disco DAG810 is a compact automatic surface grinder used for thinning silicon, III/V materials, glass types, wafers, stacked wafers, and chips.

The Datacon 2200 evo is a die bonder for epoxy die attach applications.

The Esec 2100 SC is a die bonder for die attach and chip attachment applications. The Esec 2100 SC is a 300 mm high-speed platform with epoxy bonding, 50 N bond force, and 25 µm placement accuracy.

The Esec 2100 sD advanced i is a die bonder for epoxy die attach with a 4" to 12" wafer size range. The Esec 2100 sD advanced i includes a Device Height Sensor, a High Precision Bond Head, and a Dual Dispensing Module.

The Hamatech HMR900 is a mask processor for Cr-plate wet processing or cleaning.

The Hitachi SU 8030 FEG-SEM is a field emission gun scanning electron microscope.

The MRSI 505 Die Attach is a packaging and bonding machine for semiconductor assembly, used for die attach and multichip module work.

The Esec 2100 hS iXplus is a third-generation 300 mm high-speed die bonder platform for epoxy die attach applications.

The Esec 2100 hS i is a die bonder for epoxy die attach applications and includes a dual dispensing module, high precision bond head, and high resolution vision systems.

The Esec 2100 hS is a 3rd generation 300 mm high-speed die bonder platform for epoxy die attach applications.

The Alpsitec E 460 CMP tool is a semi-automatic system for polishing and planarizing wafers.

The Esec E142 on Esec Die Bonder is an E142 strip mapping option for the Esec 2100 hS die bonder platform. The Esec 2100 hS is a high-speed die bonder for epoxy die attach applications with wafer sizes from 4 inches to 12 inches.

Riber Multi-4 is a multi-substrate production MBE system for producing compound semiconductor epiwafers.

The Thermo Fisher Scientific / FEI Strata DB 235 is a focused ion beam system with a Schottky FEG, immersion objective lens, and Magnum ion column.

The Esec 2100 hS i is a die bonder for epoxy die attach applications. The Esec 2100 hS i is a 300 mm high-speed platform with support for wafer sizes from 4 inches to 12 inches on 8-inch or 12-inch wafer frames.

The Esec 2100 sD advanced i is a die bonder for die attach applications with wafer support from 4" to 12" and bonding accuracy down to 8 µm in up-looking vision mode.

Zeiss MERLIN is a scanning electron microscope at CMi reserved for imaging and process-control inspection, with support for imaging, EDX analysis, and offline analysis in ProSEM.

The Esec 2100 SSI is a die bonder in the Esec 2100 platform family. The Esec 2100 SSI is used for epoxy die attach applications and supports wafer sizes from 4" to 12" on 8" or 12" wafer frames.

The Esec 2100 FC hS is a flip chip bonder for high-speed FC applications and epoxy die attach applications. The Esec 2100 FC hS is specified with 8 µm placement accuracy, up to 16,000 UPH, and 4-inch to 12-inch wafer support.

The Esec Datacon 2200 evo advanced is a multi-module attach die bonder for die attach and flip chip applications. The Esec Datacon 2200 evo advanced is specified for 4-inch to 12-inch wafer handling and up to ±3 µm X/Y placement accuracy at 3 sigma.

The CEE 100CB is a spinner/hotplate for handling substrates from 1 cm² to 4-inch wafers and for use with standard positive photoresists only.

The Esec 2009 fS E is a die bonder platform. The Esec 2009 fS E is described on a page for Esec die bonding products.

The Leica EM ACE600 is a sputter coater used for deposition of thin iridium films prior to SEM sample imaging.

The Esec Datacon 2200 evo plus is a die bonder for epoxy die attach applications. The Esec Datacon 2200 evo plus is specified for 4-inch to 12-inch wafers on 8-inch or 12-inch wafer frames.

The Datacon 8800 CHAMEO advanced is a flip chip bonder for wafer-level fan-out packaging and related chip-attach applications.

The Semitool 880 is a spin rinser/dryer that rinses masks and wafers in DI water to 15 MΩ and dries them with heated nitrogen.

The Zeiss LEO 1550 is a scanning electron microscope listed in the FIB / SEM / EDX / ProSEM section. The Zeiss LEO 1550 is associated with SEM imaging and sample holders for 4 inch wafers, 6 inch wafers, and 6 inch masks.

The Esec Datacon 2200 evo hF is a die bonder on Besi's 3rd-generation 300 mm high-speed platform. The Esec Datacon 2200 evo hF is specified for epoxy die attach applications and supports wafer sizes from 4" to 12" on 8" or 12" wafer frames.

The Esec Datacon 2200 evo hS is a die bonder for epoxy die attach applications. The Esec Datacon 2200 evo hS is a 300 mm high-speed platform with real-time process monitoring and a bonding accuracy of 20 µm at 3σ.

The Nikon NSR-1505G4 is a wafer stepper with 5x reduction for 5-inch reticles and 4-inch wafers, using g-line UV and providing better than 750 nm resolution and better than 150 nm alignment.

The Esec 2009 SSI E is a die bonder platform in the Packaging & Bonding category. The Esec 2009 SSI E supports epoxy die attach applications and wafer sizes from 4" to 12" on 8" or 12" wafer frames.

The Hitachi S-4700 is a field emission scanning electron microscope used for detailed image analysis and equipped with EDX capabilities.

The Esec 2009 fS E is an epoxy die bonder for 300 mm high-speed die attach applications. The Esec 2009 fS E supports wafer sizes from 4" to 12" on 8" or 12" wafer frames.

The Temescal CV-6S is an electron-beam evaporation system configured with a load-lock, dual 4-pocket e-beam sources, and a CV-6S 10 kV power supply.