SUSS MicroTec
FC 250
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The SUSS FC 250 is a die bonder for high-accuracy automated packaging of optoelectronic devices. The SUSS FC 250 provides sub-micron alignment accuracy, with alignment deviation of 1 µm at 3σ. The SUSS FC 250 can operate at temperatures up to 450°C and bonding forces from 10 gf to 200 kgf.[1]
What it is
How it works
The FC 250 uses optical alignment, a bonding arm, and heated chucks for flip-chip style attachment.[1]
Where it fits in the process flow
General reference — not yet source-verifiedThe FC 250 sits in back-end packaging and assembly rather than front-end wafer fabrication.
The FC 250 is suited to align, place, and bond chips to substrates for device assembly.
What do the numbers mean?
Wafer handling1
Optics & imaging3
Performance3
Configuration & options11
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What kinds of interconnect materials can this class of machine support?General reference — not yet source-verified
Depending on the setup, it can support solder bump interconnects, plated copper pillars, gold stud bumps, or conductive adhesives.
Why is flip-chip bonding used instead of traditional wire bonding?General reference — not yet source-verified
Flip-chip bonding generally provides shorter interconnect paths, higher input/output density, and improved electrical and thermal performance for advanced packaged devices.
Not publicly documented
The following facts about the FC 250 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the FC 250 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the FC 250 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the FC 250 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the FC 250 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the FC 250 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]web.archive.org — suss.com (Nov 6, 2002)web.archive.org
- [2]Inventory photo
- [3]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 12, 2026.
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