SUSS MicroTec
SB8E
The SUSS MicroTec SB8E is a VAC substrate bonder. The SUSS MicroTec SB8E supports wafers up to 150mm. The SUSS MicroTec SB8E uses control software on Windows NT.[1][2]
Plate 01Suss SB8e Substrate Bonder Demonstration
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Where it fits in the process flow
The SUSS MicroTec SB8E bonds the substrate stack after alignment. The SUSS MicroTec SB8E then mechanically clamps the aligned stack using the transport fixture or later-welds the stack for further processing in the tool chamber.[1]
Applications
The SUSS MicroTec SB8E supports anodic bonding, silicon fusion bonding, adhesive bonding, and thermal compression bonding. The SUSS MicroTec SB8E is used for microfluidics, pressure sensors, optoelectronics, MEMS, packaging, and SOI production.[1][2]
- Microfluidics
- pressure sensors
- optoelectronics
- MEMS
- Packaging
- SOI production
What do the numbers mean?
Power & electrical1
Vacuum & pumping2
Wafer handling2
Control & software1
Configuration & options2
- Bonding processes
- Anodic Bonding, Silicon Fusion Bonding, Adhesive Bonding, Thermal Compression Bonding[1]2 sources
Vintage & configurations
Control-system eraWindows NT[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the SB8E are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SB8E are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the SB8E are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
No publicly documented failure modes or field errata for the SB8E are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the SB8E is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the SB8E are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]cnfusers.cornell.edu — cnfusers.cornell.educnfusers.cornell.edu
- [2]SB8E — SUSS MicroTec | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 17, 2026.
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