SUSS MicroTec

SB8E

Packaging & Bonding 150mm SUSS MicroTec SB8E family

Research Quality: 40% complete

LinkedIn X Email

SB8E — cnfusers.cornell.edu — Fig. 01SB8Ecnfusers.cornell.edu^[1]

Plate 01Suss SB8e Substrate Bonder Demonstration
ClassOneVideosWatch on YouTube

Wafer size

150mm

Vacuum

down to 5x10e-5 mbar^[1]

Control era

Windows NT

What is it?

The SB8e is described as a universal tool for bonding processes for micro-electro-mechanical systems, with processes including anodic bonding, silicon fusion bonding, adhesive bonding, and thermal compression bonding. The source states it can sustain wafers up to 150 mm, operates under vacuum to 5x10e-5 mbar with overpressure up to 3 bar, and uses a PC running control software on Windows NT.

What can it run?

Process applications and technology nodes documented for this tool.

Microfluidics
pressure sensors
optoelectronics
MEMS
Packaging
SOI production

What do the numbers mean?

Power & electrical1

Power supply: 0 to +/- 2000 VDC with maximum current at 15mA^[1]

Vacuum & pumping2

Vacuum level: down to 5x10e-5 mbar^[1]
Overpressure: up to 3 bar^[1]

Wafer handling2

Tool type: VAC substrate bonder^[1]
Maximum wafer size: up to 150mm^[1]

Control & software1

Control software platform: Windows NT^[1]

Configuration & options2

Bonding processes: Anodic Bonding, Silicon Fusion Bonding, Adhesive Bonding, Thermal Compression Bonding^[1]
Heating: Double-side heating up to 550 Degrees Celsius^[1]

Vintage & configurations

Control-system eraWindows NT^[1]

Interested in this tool?

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Vacuum leveldown to 5x10e-5 mbar^[1]
Overpressureup to 3 bar^[1]
Power supply0 to +/- 2000 VDC with maximum current at 15mA^[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the SB8E are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SB8E are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the SB8E are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
No publicly documented failure modes or field errata for the SB8E are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the SB8E is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the SB8E are on record.
Answerable by: an OEM parts catalog or a service engineer

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (1)Every fact above is drawn from these public sources

[1]cnfusers.cornell.edu — cnfusers.cornell.educnfusers.cornell.edu

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Last updated Jul 29, 2026.

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