EV Group

850 SOI Wafer

Packaging & Bonding 150mm EV Group 850 family

Research Quality: 30% complete

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850 SOI Wafer — Inventory photo — Fig. 01850 SOI WaferInventory photo^[1]

Wafer size

150mm

Vacuum

One bonding station with high vacuum^[1]

What is it?

The EVG 850 SOI Wafer Bonder is a fully automatic wafer bonder suitable for wafer sizes up to 6 inch/150mm and currently configured for 6 inch/150mm wafers.

What do the numbers mean?

Vacuum & pumping1

One bonding station with high vacuum^[1]

Accurate?

Wafer handling4

Wafer size: Suitable for wafer sizes up to 6"/150mm wafers^[1]; Currently configured for 6"/150mm wafers^[1]; One Genmark Robot with pre-aligner^[1]; Programmable rotational speed for substrate cleaning^[1]

Control & software1

PC controlled with windows based graphical user interface^[1]

Accurate?

Configuration & options5

Fully-Automatic^[1]

Accurate?

Two Cleaning Modules^[1]

Accurate?

Mechanical pre-aligner on bond station (pneumatically actuated)^[1]

Accurate?

Password protected access levels^[1]

Accurate?

Megasonic cleaning option^[1]

Accurate?

Interested in this tool?

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

ConfigurationOne bonding station with high vacuum^[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the 850 SOI Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 850 SOI Wafer are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 850 SOI Wafer are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 850 SOI Wafer are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 850 SOI Wafer are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 850 SOI Wafer is not on record.
Answerable by: an OEM datasheet or a fab qualification report