SUSS MicroTec
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The SUSS XBS200 is a permanent bonding system from SUSS MicroTec. The XBS200 belongs to SUSS MicroTec's permanent bonding product range. The XBS200 is used for permanent bonding applications.[1]
The SUSS MicroTec XBS200 is a permanent bonding system used in semiconductor packaging.[1]
Permanent bonders apply heat and pressure to the substrate stack in a controlled atmosphere, often under vacuum, to achieve a metallurgical or adhesive bond. The process may involve eutectic alloy formation, thermocompression, or glass-frit sealing, depending on the materials and bond requirements. Alignment between wafers is achieved using optical or mechanical pre-alignment stages before the bonding force is applied.
Permanent bonding systems are used in the fabrication of three-dimensional integrated circuits, microelectromechanical systems, image sensors, and advanced memory stacks. The process is also applied in hybrid bonding for fine-pitch interconnects and in wafer-level packaging of radio-frequency and power devices.
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The XBS200 is a permanent bonding system for semiconductor packaging.[1]
The following facts about the XBS200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the XBS200 are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the XBS200 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the XBS200 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the XBS200 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the XBS200 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Last updated Sep 22, 2026.
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