SVG
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The SVG / Perkin Elmer 300 HT is a lithography tool. The model designation is 300 HT. The equipment was produced by SVG and Perkin Elmer.[1]
Alignment between the mask and the wafer is achieved through mechanical positioning stages and optical alignment sensors. The system may operate in a scanning mode, moving the mask and wafer synchronously past a slit, or in a step-and-repeat mode, exposing one die field at a time.
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The following facts about the 300 HT Lithography are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the 300 HT Lithography are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 300 HT Lithography are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 300 HT Lithography are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 300 HT Lithography are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 300 HT Lithography are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Last updated Aug 20, 2026.
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.