Takatori
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The Takatori MWS 612 is a wire saw. The Takatori MWS 612 is in the Dicing & Grinding category. The Takatori MWS 612 has a maximum workpiece shape of φ150mm x 300mm.[1][2]
A dicing and grinding machine class is used to separate or shape semiconductor and precision components after earlier fabrication steps.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| MWS 612 DD Multi | — | — | Described as a wire saw for 6-inch wafers. | waferpedia.com[3] |
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The following facts about the MWS 612 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MWS 612 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the MWS 612 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MWS 612 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the MWS 612 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the MWS 612 are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Oct 12, 2026.
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