Waferpedia

Takatori

MWS 612

Dicing & GrindingTakatori MWS 612 family
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This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Takatori MWS 612 is a wire saw. The Takatori MWS 612 is in the Dicing & Grinding category. The Takatori MWS 612 has a maximum workpiece shape of φ150mm x 300mm.[1][2]

TakatoriMWS 612
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What it is

The Takatori MWS 612 is a wire saw in the Dicing & Grinding category.[2][3]

The Takatori MWS 612 has a maximum workpiece shape of φ150mm x 300mm.[1][2][3]

How it works

General reference — not yet source-verified

A dicing and grinding machine class is used to separate or shape semiconductor and precision components after earlier fabrication steps.

Where it fits in the process flow

The Takatori MWS 612 belongs in the dicing and grinding portion of backend processing.[2][3]

Applications

The Takatori MWS 612 is used for wire-saw processing in dicing and grinding workflows.[2][3]

The Takatori MWS 612 DD Multi is a wire saw for 6-inch wafers.[3]

What do the numbers mean?

Wafer handling1

Described variant
Takatori MWS 612 DD Multi is a wire saw for 6-inch wafers[3]
Accurate?

Configuration & options3

Maximum workpiece shape
φ150mm x 300mm[1]
Accurate?
Equipment type
Wire saw[2]
Accurate?
Category
Dicing & Grinding[2]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
MWS 612 DD Multi——Described as a wire saw for 6-inch wafers.waferpedia.com[3]
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What type of machine is the Takatori MWS 612?

The Takatori MWS 612 is a wire saw in the Dicing & Grinding category.[2][3]

What is the maximum workpiece shape for the Takatori MWS 612?

The Takatori MWS 612 has a maximum workpiece shape of φ150mm x 300mm.[1][2][3]

Not publicly documented

The following facts about the MWS 612 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MWS 612 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the MWS 612 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the MWS 612 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the MWS 612 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the MWS 612 are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.com — waferpedia.comwaferpedia.com
  3. [3]waferpedia.com — waferpedia.comwaferpedia.com
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Last updated Oct 12, 2026.

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