Takatori

A multi-wire saw operates by passing a wire web across the workpiece while an abrasive slurry is applied to the wire. The wire is spooled from a supply spool through a series of grooved guide rollers to create a set of parallel wires. The workpiece is fed into the wire web, and the wire moves back and forth to cut through the material.
Applications include slicing silicon ingots into wafers for semiconductor device fabrication. The Takatori MWS 612 DD Multi may also be used for cutting other brittle materials such as sapphire, silicon carbide, or gallium nitride.
Documented failure modes, common issues, and field considerations.
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The following facts about the MWS 612 DD Multi are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MWS 612 DD Multi are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the MWS 612 DD Multi are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the MWS 612 DD Multi are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the MWS 612 DD Multi is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the MWS 612 DD Multi are on record.
Answerable by: an OEM parts catalog or a service engineer
Last updated Oct 12, 2026.
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