Waferpedia

Tegal

3200

advanced cluster platform200mmTegal 3200 family
Research Quality: 60% complete
LinkedIn X Email
3200 — web.archive.org
Fig. 013200web.archive.org[1]

What it is

The Tegal 3200 SE is an advanced cluster platform dedicated to 3D IC and MEMS applications.[1]

It can be configured with up to 3 process modules for mass production.[1]

How it works

The Tegal 3200 cluster tool may be configured on request for Silicon (Si), Silicon On Insulator (SOI), and Silicon Dioxide (SiO2). The system is able to provide a wide range of processes with high etch rate, high mask selectivity, excellent etch uniformity, and profile control.[1]

Where it fits in the process flow

Wafer sizes from 100 to 200 mm can be accommodated with a quick size change kit.[1]

Applications

The Tegal 3200 SE is dedicated to 3D IC and MEMS applications.[1]

Configured materials include Silicon (Si), Silicon On Insulator (SOI), and Silicon Dioxide (SiO2).[1]

  • MEMS
  • semiconductor device fabrication

What do the numbers mean?

Wafer handling1

wafer size range
100 to 200 mm[1]
Accurate?

Optics & imaging1

process attributes
High etch rate, high mask selectivity, excellent etch uniformity, and profile control[1]
Accurate?

Configuration & options2

process modules
Up to 3 process modules[1]
Accurate?
materials
Silicon (Si), Silicon On Insulator (SOI), and Silicon Dioxide (SiO2)[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
3200 SE——Configured with up to 3 process modules; accommodates wafer sizes from 100 to 200 mm with a quick size change kit; configurable for Silicon (Si), Silicon On Insulator (SOI), and Silicon Dioxide (SiO2).web.archive.org[1]
Interested in this tool?
Embed spec card

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Frequently asked questions

What applications is the Tegal 3200 SE dedicated to?

It is dedicated to 3D IC and MEMS applications.[1]

How many process modules can it be configured with?

It can be configured with up to 3 process modules.[1]

Which wafer sizes does it accommodate?

It accommodates wafer sizes from 100 to 200 mm with a quick size change kit.[1]

Which materials can it be configured for?

It may be configured for Silicon (Si), Silicon On Insulator (SOI), and Silicon Dioxide (SiO2).[1]

Not publicly documented

The following facts about the 3200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 3200 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the 3200 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 3200 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 3200 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the 3200 are on record.

    Answerable by: an OEM parts catalog or a service engineer

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
Was this page accurate?

Last updated Jul 27, 2026.