Tegal

The Tegal 4200 SE is an advanced cluster platform for 3D IC and MEMS applications.

The Tegal 421 (Plasmaline 421) is a barrel-type oxygen plasma asher used for photoresist stripping.

The Tegal 3200 SE is an advanced cluster platform for 3D IC and MEMS applications that can be configured with up to 3 process modules.

The Tegal 900ACS is a single-wafer cassette-to-cassette non-critical plasma etch system for 75mm to 200mm wafers.

Tegal 980 ACS is a plasma etch system series described as serving the 200mm fab line.

The Tegal 200 SE is a DRIE system described as suited for 3D-SiP and MEMS volume manufacturing.

The Tegal 901G is a diode plasma etcher specially configured for GaAs processing and used for etching high-performance devices on gallium arsenide substrates.

The Tegal 6550 is a plasma etch reactor/system for etching non-volatile metal and metal oxide films, with a dual-chamber platform and patented rinse-strip-rinse capability.

The Tegal 900 is a plasma etch system used for applications including defreckling, backside nitride etching, and processing III-V materials.

The Tegal 6510 is a high-density CCP plasma etch tool with dual-frequency RF power application and magnetic plasma confinement.

The Tegal 6520 is a high-density CCP plasma etch tool with dual-frequency RF power application and magnetic plasma confinement.

The Tegal 6540 is a high-density plasma etch system used for etching difficult-to-etch materials in MEMS and related semiconductor applications.

The Tegal 900e Series is a single-wafer cassette-to-cassette plasma etch system for non-critical plasma etch processes on 3 in to 150 mm wafers.

The Tegal 901e is a diode plasma etcher used for GaAs and other semiconductor applications, with source-described substrate handling for 75 mm to 150 mm round wafers and some rectangular substrates.

The Tegal 903e is a diode plasma etch tool used for applications including oxide etching and other semiconductor and compound-semiconductor etch processes.

The Tegal 983 is a diode plasma etch tool for pad passivation, oxide contact/via, spacer, polyimide ILD, and resist/SOG planarization applications.

The Tegal 1511e is a tri-electrode dual-frequency plasma etch system for processing three- to six-inch wafers.

The Tegal 915 is a plasma barrel etcher with batch capacity for 100 mm, 125 mm, and 150 mm wafers.

The Tegal 981 is a plasma etch tool for thin film head fabrication, described as achieving precise photoresist descum with 4:1 anisotropy at low processing temperatures in oxygen-free plasmas.

The Tegal 6500 is a 2-chamber nitride etch system.

The Tegal 6500 U is a 2-chamber nitride etcher.

The Tegal 110 SE is a compact, flexible plasma etch system for process development applications, with deep silicon etching capabilities for MEMS and 3D-IC components.