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Tegal

4200

cluster platform200mmTegal 4200 family
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4200 — web.archive.org
Fig. 014200web.archive.org[1]

What it is

The Tegal 4200 SE is a cluster platform dedicated to 3D IC and MEMS applications.[1]

The system can be configured with up to 4 process modules and 2 cassette modules.[1]

How it works

The Tegal 4200 cluster tool may be configured on request for silicon, silicon on insulator, and silicon dioxide.[1]

The system is able to provide a wide range of processes with high etch rate, high mask selectivity, excellent etch uniformity, and profile control.[1]

Where it fits in the process flow

Wafer sizes from 100 to 200 mm can be accommodated with a quick size change kit.[1]

Applications

The system is dedicated to 3D IC and MEMS applications.[1]

It may be configured for silicon, silicon on insulator, and silicon dioxide used in MEMS and semiconductor device fabrication.[1]

  • MEMS

What do the numbers mean?

Wafer handling2

Cassette modules
Up to 2 cassette modules[1]
Accurate?
Wafer size range
100 to 200 mm[1]
Accurate?

Optics & imaging1

Processes
Wide range of processes with high etch rate, high mask selectivity, excellent etch uniformity, and profile control[1]
Accurate?

Configuration & options2

Process modules
Up to 4 process modules[1]
Accurate?
Materials
Silicon (Si), Silicon On Insulator (SOI), and Silicon Dioxide (SiO2)[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
4200 SE———web.archive.org[1]
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What applications is the Tegal 4200 SE dedicated to?

It is dedicated to 3D IC and MEMS applications.[1]

How many process and cassette modules can it support?

It can be configured with up to 4 process modules and 2 cassette modules.[1]

What wafer sizes can it accommodate?

It can accommodate wafer sizes from 100 to 200 mm with a quick size change kit.[1]

What materials can it be configured for?

It may be configured for silicon, silicon on insulator, and silicon dioxide.[1]

Not publicly documented

The following facts about the 4200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 4200 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the 4200 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 4200 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 4200 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the 4200 are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
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Last updated Jul 27, 2026.